Emi shielding device

ABSTRACT

An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

CROSS REFERENCE TO RELATED APPLICATION

This present application is a divisional application (specifically uponobjects depicted in FIG. 10) of U.S. application Ser. No. 11/705,016,which was filed Feb. 12, 2007 now pending. This application isincorporated in its entirety by reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an EMI shielding device, and morespecifically to an EMI shielding device that shield s electricalcomponents, such as a chip or a CPU, from EMI.

2. Description of the Prior Art

A shielding cover is used to shield electrical components from EMI(Electromagnetic Interference) and prevents electrical components set onthe circuit board of an electronic device (such as a mobile phone, aPDA, or a computer) from the effects of EMI. The electrical componentmay be a chip or a CPU, etc. The shielding cover covers the outside ofthe electrical component set on a circuit board to shield the electricalcomponents from EMI.

However, the shielding cover must be welded onto the circuit board by anSMT (surface mount technology) process, thus, the material of theshielding cover must be a certain welding material. However, the cost ofsuch material is high. Moreover, when the electronic device needs to berepaired, the top board of the shielding cover must be lifted away, andanother top board is needed after the repair to place the EMI shield,further increasing costs.

Hence, the inventors of the present invention believe that theseshortcomings above are able to be improved upon and suggest the presentinvention which is of a reasonable design and is an effectiveimprovement based on deep research and thought.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an EMI shieldingdevice, of which the material of the shielding cover is widely used, sothat the cost of the material is reduced. Thereby, after the shieldingcover has been opened, it is easy to restore the shielding state, andanother cover doesn't need to replace the original shield.

Another object of the present invention is to provide an EMI shieldingdevice, in which the assembling of the shielding cover is easy, thesurface of which is flat, and which is not limited by changes in theshape or the structure of the shell, so applicability is improved.

To achieve the above-mentioned objects, an EMI shielding device isdisclosed. The shielding device is set in an electronic device andcomprises a shell, a circuit board set in the shell, and an electricalcomponent set on the circuit board. The shielding device comprises amiddle board and a shielding cover. The middle board is set inside theelectronic device and the shielding cover is set on the middle board andcovers the outside of the electrical component.

The advantages of the present invention are that the shielding cover ofthe present invention doesn't need to be welded on the circuit board;the material of the shielding cover is widely used, so the material'scost is reduced; to repair the electrical component, the middle boardand the circuit board can be separated to open the shielding cover;after repairing, the middle board can be fixed inside the electronicdevice to cover the shielding cover over the electrical component torestore the shield. Moreover, the shielding cover is set inside theelectronic device by the middle board, so assembly is easy, the surfaceis flat, and the shield is not limited by changes in the shape or thestructure of the shell, so applicability is improved.

To further understand the features and technical contents of the presentinvention, please refer to the following detailed description anddrawings related to the present invention. However, the drawings areonly to be used as references and explanations, and not to limit thepresent invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a first embodiment of the present invention;

FIG. 2 is an explored isometric view of the first embodiment of thepresent invention;

FIG. 3 is a cutaway view of the first embodiment of the presentinvention;

FIG. 4 is an explored isometric view of a second embodiment of thepresent invention;

FIG. 5 is a cutaway view of the second embodiment of the presentinvention;

FIG. 6 is an explored isometric view of a third embodiment of thepresent invention;

FIG. 7 is a cutaway view of the third embodiment of the presentinvention;

FIG. 8 is an explored isometric view of a fourth embodiment of thepresent invention;

FIG. 9 is a cutaway view of the fourth embodiment of the presentinvention;

FIG. 10 is an isometric view of a fifth embodiment of the presentinvention;

FIG. 11 is a cutaway view of a sixth embodiment of the presentinvention;

FIG. 12 is an isometric view of a shielding cover of a seventhembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1-3, an EMI shielding device of the present inventionis set in an electronic device, the device's number being unlimited. Theelectronic device includes a shell 4 and a circuit board 5 set in theshell 4 and an electrical component 6 set on the circuit board 5. Theshell 4 includes an upper shell 41 and a lower shell 42. The upper shell41 and the lower shell 42 are assembled or opened by catches or lockingscrews. The shielding device includes a middle board 1, a shieldingcover 2, and a spring component 3. The middle board 1 is made of metal,rubber or other materials. The middle board 1 is also known as an innerboard. The shape of the middle board is unlimited. A plurality of fixingholes 11 are set on the edge of the middle board 1 to fix the lockingscrews inside the electronic device. The middle board 1 is locked ontothe circuit board 5 or the shell 4.

The middle board 1 of the embodiment is fixed on the circuit board 5 orthe shell 4 via locking screws, but the fixing method is unlimited. Themiddle board 1 of the embodiment is fixed on the circuit board 5 or theshell 4 inside the electronic device by methods such as hot melting,riveting, spot welding, clamp-jointing or screwjointing, etc. Aplurality of connectors 12 are set on the middle board 1, and theplurality of connectors 12 are in-molded on the middle board 1 orassembled thereon. In the present embodiment, the connectors 12 are madeof hot-melting material.

The shielding cover 2 is made of metal and is cube-shaped and emptyinside, however the shielding cover 2 can be any other shape. Theshielding cover 2 includes a top board 21 and side boards 22 extendingdownwards around the edge of the top board 21. The top board 21 and theside boards 22 form a containing space 23. The containing space 23 isinside the shielding cover 2 and can contain an electrical component 6.The shielding cover 2 covers the electrical component 6.

Protruding flanges 24 extend outwards from four angles of the top board21. Each protruding flange 24 defines a connecting hole 25 thereon. Eachconnector 12 can be inserted into the corresponding connecting hole 25.The connectors 12 and the connecting holes 25 are fixed and joined byhot-melting to make the shielding cover 2 join the middle board 1corresponding to the electrical component 6. The jointing method of theshielding cover 2 and the middle board 1 is hot-melting, but the middleboard can also be riveted, spot welded, clamp-jointed or screw-jointed,etc. The jointing methods are unlimited.

A plurality of protruding points 34 are defined on the top board 21 ofthe shielding cover 2 by punching thereon to form a spring component 3.The protruding points 34 protrude out of the top board 21 and sustainthe bottom of the middle board 1 to press down the shielding cover 2befittingly. Thus, the bottom edge of the shielding cover 2 can sustainthe topside of the circuit board 5 elastically to join the shieldingcover 2 and the circuit board 5 firmly.

When the shell 4 is assembled and the middle board 1 is fixed inside theelectronic device, the shielding cover 2 set on the middle board 1covers an outside of the electrical component 6. Thus, the EMI effect onthe operation of the electrical component 6 can be prevented by theshielding of the shielding cover 2. The EMI shielding device of thepresent invention is formed by the structure.

To repair the electrical component 6, the shell 4 of the electronicdevice is opened to separate the middle board 1 and the circuit board 5.The shielding cover 2 comes apart with the electrical component 6. Thus,the electrical component 6 is easy to open and repairing is convenient.After repairing, the middle board 1 is fixed inside the electronicdevice to make the shielding cover 2 cover the electrical component 6thereby restoring the shielding state.

Referring to FIGS. 4 and 5, the spring component 3 of the embodimentcontacts the bottom edge of the side boards 22 of the shielding cover 2.The spring component 3 and the bottom edge of the side boards 22 of theshielding cover 2 are in-molded or assembled. For the preferredembodiment, the spring component 3 is a rubber component 31. When themiddle board 1 is fixed inside the electronic device, the shieldingcover 2 covers the electrical component 6. The rubber component 31 isthen injected with glue to join the bottom edge of the side boards 22 ofthe shielding cover 2. The rubber component 31 is set between the bottomedge of the side boards 22 of the shielding cover 2 and the circuitboard 5 to join the shielding cover 2 and the circuit board 5 togetherfirmly. Thus, the EMI effect on the operation of the electricalcomponent 6 can be prevented by the shielding of the shielding cover 2.

To repair the electrical component 6, the shell 4 of the electronicdevice is opened to separate the middle board 1, the shielding cover 2,the circuit board 5 and the spring component 3. The shielding cover 2 isseparated from the electrical component 6. Thus, the electricalcomponent 6 is easy to open and repairing is convenient. Afterrepairing, the middle board 1 is fixed inside the electronic device tomake the shielding cover 2 cover the electrical component 6 to restorethe shielding state.

Please refer to FIGS. 6-9. The connecting holes 25 of the preferredembodiment are defined on the top of the shielding cover 2, that is, theconnecting holes 25 are defined on the top board 21 of the shieldingcover 2. The connectors 12 and the connecting holes 25 are fixed andjoined by hot-melting to make the shielding cover 2 join the middleboard 1 corresponding to the electrical component 6. The springcomponent 3 of the embodiment is a plurality of spring plates 32 and 33in-molded on the bottom edge of the side boards 22 of the shieldingcover 2. The spring plate 32 extends and bends outwards (as shown inFIGS. 6 and 7), the spring plate 33 extends and bends inwards (shown asFIGS. 8, 9). When the middle board 1 is fixed inside the electronicdevice, the shielding cover 2 covers the electrical component 6. Thespring plates 32, 33 sustain elastically the top of the circuit board 5,and the spring plates 32, 33 are set between the bottom edge of the sideboards 22 of the shielding cover 2 and the circuit board 5 to join theshielding cover 2 and the circuit board 5 firmly.

Referring to FIG. 10, the middle board 1 and the shielding cover 2 arein-molded, that is, the top board 21 of the shielding cover 2 isin-molded onto the middle board 1. Four side boards 22 extend downwardsaround the edge of top board 21 by punching on the middle board 1. Thetop board 21 and the side boards 22 form a containing space 23. Themiddle board 1 and the shielding cover 2 are in-molded, and a pluralityof shielding covers 2 can be set upon the middle board 1. Such a designreduces material usage, makes assembly convenient, and lowers costs.

Referring to FIGS. 11 and 12, the spring component 3 of the embodimentis a plurality of spring bodies 35. The spring bodies 35 contact thebottom edge of the side boards 22 of the shielding cover 2. The bottomedge of the side boards 22 of the shielding cover 2 extends and bendsoutwards. The spring bodies 35 are set at the extending and bendingpoint of the side boards 22. The spring bodies 35 sustain the top of thecircuit board 5 elastically.

Consequently, the shielding cover 2 of the present invention doesn'tneed to be welded on the circuit board 5 by a process of SMT. Thematerial of the shielding cover 2 is widely used, so the cost of thematerial is markedly reduced. Moreover, to repair the electricalcomponent 6, the shell 4 is opened to separate the middle board 1, theshielding cover 2 and the circuit board 5 to make the shielding cover 2open. After repairing, the middle board 1 is fixed inside the electronicdevice to make the shielding cover 2 cover the electrical component 6 torestore shielding. Shielding is restored easily and another cover isn'trequired.

Also worth mentioning is that the shielding cover 2 of the presentinvention is set inside the electronic device by the middle board 1. Themiddle board 1 can also be locked on the circuit board 5 or the shell 4.Assembling is therefore easy, surface flatness of the middle board 1 ismaintained and the shielding cover 2 is locked on the shell 4indirectly, so as not to be limited by changes in the shape or thestructure of the shell 4, thereby improving applicability.

What is disclosed above are only the preferred embodiments of thepresent invention, and therefore it is intended that the presentinvention not be limited to the particular embodiment disclosed. Itshould be understood by those skilled in the art that various equivalentchanges may be made depending on the specification and the drawings ofpresent invention without departing from the scope of the presentinvention.

1. An EMI shielding device, set in an electronic device, the electronicdevice comprising a shell, a circuit board set inside the shell and aplurality of electrical components set on the circuit board inside theshell, the shielding device comprising: a middle board located insidethe shell; and a plurality of shielding covers located between themiddle board and the circuit board, each of the shielding covers furtherhaving a top board in-molded onto the middle board and four side boardsextending downward from edges of the top board so as to form acontaining space thereinside for circulating the respective electricalcomponent on the circuit board; the side boards having respective bottomedges close to the circuit board.
 2. The EMI shielding device as claimedin claim 1, wherein said side board is an extrusion punched down fromsaid middle board.
 3. The EMI shielding device as claimed in claim 1,wherein said middle board defines a plurality of fixing holes thereonand is locked in said electronic device by screwing.
 4. The EMIshielding device as claimed in claim 1, wherein said middle board isfixed in said electronic device by a method selected from the group ofhot melting, riveting, spot welding, clamp-jointing, and screw-jointing.5. The EMI shielding device as claimed in claim 1, wherein said middleboard is fixed on said circuit board.
 6. The EMI shielding device asclaimed in claim 1, wherein said middle board is fixed on said shell. 7.The EMI shielding device as claimed in claim 1, further including aplurality of spring components, each of the spring components locatedbetween said bottom edges of said side boards of one said shieldingcover and said circuit board to join together elastically saidrespective shield cover and said circuit board and to seal saidrespective electrical component inside said containing space betweensaid respective shielding cover and said circuit board.